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Sense the Future of the Light

  • About SensLite
  • Epitaxial Wafers
    • Data Center
    • Telecom
    • Epitaxial Wafer (Epiwafer)
      • 3’’ InP Substrate
      • Zn-diffusion completed epiwafer
      • 650nm LD epiwafer
      • 808nm Laser Epiwafer
      • 1550nm MQW Epiwafer
      • GaAs Base Epiwafer
      • InP Base epiwafer
      • Gallium Oxide (Ga2O3) Epitaxial Wafer
    • Chips and Packages
      • Silicon-Based Thermopile IR Sensor
      • 650nm Resonant cavity light emitting diode (RCLED)
      • 1310/1550nm 2.5Gbps APD-TIA TO Package
      • 1310nm 1.25/2.5Gbps DFB Laser TO Package 6.7mm FD
      • 1310nm 1.25/2.5Gbps DFB Laser TO Package 7.5mm FD
      • 1310/1550nm 2.5Gbps APD-TIA TO Package
      • 40G 1310nm PIN PD Chip
      • 40G 850nm PIN PD Chip
  • MEMS Mirrors
    • 1D Mirror
    • 2D Mirrors
    • 2D MEMS Laser Scanning Module
    • MEMS Controllers
    • MEMS Drivers
    • Development Kits
    • Software Suite
    • Datasheet and Guides
    • Applications
    • Relevant Publications
  • LED Lighting
    • LED Materials
    • LED Chips and Package
    • Zener Diode
    • LED Driver IC
    • Package Options
      • 5.50mm ɸ 2.54 pitch
      • 5.50mm ɸ 2.84pitch
    • LED Display
      • P10 32×16
      • P12 16×16
    • LED MCPCB Seamless Module
      • 3.9mm width
      • 4.9mm Width
  • Equipments
    • PG01 Pressure Gauge
    • Wireless Otoscope
  • Contact Us
Uncategorized

SensLite Lighting Launched A Commercial & Industrial LED Lighting Solution Provider

SensLite Lighting Launched A Commercial & Industrial LED Lighting Solution Provider http://senslite.com.tw/lighting/    

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Uncategorized

Flip Chip LED Eutectic bonding COB LED Lighting Solutions 150W LED RGB Stage Light (PAR64)

Feature: High Power LED Flip Chip Flip Chip Chip on Board Package Eutectic Chip bonding Technology High efficiency heat dissipation technology with Vapor Chamber             150W LED RGB Stage Light (PAR64) Item Specification 1

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Uncategorized

Flip Chip LED Eutectic bonding COB LED Lighting Solutions 300W High Pole Light

Feature: High Power LED Flip Chip Flip Chip Chip on Board Package Eutectic Chip bonding Technology High efficiency heat dissipation technology with Vapor Chamber               300W High Pole Light Item Specification 1 Fixture

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  • MEMS Mirrors
  • Epitaxial Wafers
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Various type of MEMS package

SensLite has been providing services for the LED, III-Vs, Optical Communication and MEMS semiconductor industries for more than 17 years and counting.

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