Flip Chip InGaN BLue LED Chip

□      Features: · Long operation life · High anti-ESD level · 100%probing test · Passivation layer on top · High radiant flux Mechanical Specifications Description Dimension Tolerance P-N Junction Area (μm) 220*535  +- 30 Chip Area (μm) 250*570  +-

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OEM Patterned-Sapphire Substrate Process (PSS Process for LED)

OEM Patterned-Sapphire Substrate Process Service Available Patterned Sapphire Substrates for LED enhancement Patterned Sapphire Wafer Size for 2-inch, 4-inches and 6-inches wafer . Benefit of PSS-Based LED: More Efficient More effective light sources. Higher Gross Margins [contact-form-7 id=”2564″ title=”Contact”]

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