Multi Layer Cu/Mo Clad Metal for LED Epi Wafer Substrate
Super CMC/MCM Multi Layer Cu/Mo Clad Metal for LED Epi Wafer Substrate High Thermal Conductivity : 200~350w/mk Low Thermal Expansion : 6~10ppm/℃ Thickness :≧90μm Application: LED Epi Wafer Substrate , etc. Introduction: Our newly developed Clad material is built-up
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