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  • About SensLite
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      • 3’’ InP Substrate
      • Zn-diffusion completed epiwafer
      • 650nm LD epiwafer
      • 808nm Laser Epiwafer
      • 1550nm MQW Epiwafer
      • GaAs Base Epiwafer
      • InP Base epiwafer
      • Gallium Oxide (Ga2O3) Epitaxial Wafer
    • Chips and Packages
      • Silicon-Based Thermopile IR Sensor
      • 650nm Resonant cavity light emitting diode (RCLED)
      • 1310/1550nm 2.5Gbps APD-TIA TO Package
      • 1310nm 1.25/2.5Gbps DFB Laser TO Package 6.7mm FD
      • 1310nm 1.25/2.5Gbps DFB Laser TO Package 7.5mm FD
      • 1310/1550nm 2.5Gbps APD-TIA TO Package
      • 40G 1310nm PIN PD Chip
      • 40G 850nm PIN PD Chip
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    • LED Materials
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    • Zener Diode
    • LED Driver IC
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      • 5.50mm ɸ 2.54 pitch
      • 5.50mm ɸ 2.84pitch
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      • P10 32×16
      • P12 16×16
    • LED MCPCB Seamless Module
      • 3.9mm width
      • 4.9mm Width
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Mirrorcle SyMPL 3D LiDAR
Press, Uncategorized

SyMPL 3D LiDAR from Mirrorcle Technologies – plug-and-play today

Mirrorcle’s new SyMPL 3D LiDAR now is live and running in the Moscone Center (4-6, February, 2020). Get a change to see your own 3D point cloud data live! Mirrorcle Offical Press release click here. SyMPL 3D LiDAR Features

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SPIE Photonics West Mirrorcle Technologies 2020 booth at 3081 QR scan
Uncategorized

SPIE. Photonics West 2020 Mirrorcle showcase SyMPL 3D LiDAR System

Featured Product: Compact, MEMS mirror-based 3D LiDAR system – programmable scans yield 3D point-cloud data MEMS mirror-based 3D LiDAR system – “SyMPL” – a compact, lightweight solution for programmable scans that yield 3D point-cloud data for robotics and industrial

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MirrorcleTech SyMPL Lidar Solution at CES2020
Press

What to expect at CES 2020: SyMPL LiDAR (MP26066)

Come visit Mirrorcle Technologies’ newest MEMS Lidar, SyMPL Lidar at Microchip booth in CES 2020. Scan the QR code or click the link to locate us while you’re at the show! “Mirrorcle’s new lidar system is expected to cost

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Various type of MEMS package

SensLite has been providing services for the LED, III-Vs, Optical Communication and MEMS semiconductor industries for more than 17 years and counting.

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