Features: Measurement for wafer thickness, TTV, bow and warp High Flexibility: 2”, 4”, 6” Wafer 12-15 load-ports for carriers High Throughput Rate: 1 point measurement capacity 1200 pieces/hr Multiple measurement method: single point, cross (9 points), asterisk (17 points) High

Features: Measurement for wafer thickness, TTV, bow and warp High Flexibility: 2”, 4”, 6” Wafer 12-15 load-ports for carriers High Throughput Rate: 1 point measurement capacity 1200 pieces/hr Multiple measurement method: single point, cross (9 points), asterisk (17 points) High

Description Application Wavelength Range Processed InP base epiwafer RWG DFB laser (Ridge Waveguide) 1250nm~1630nm BH-FP laser (Buried Heterostructure) 1250nm~1630nm Photo-detector 1100nm~1600nm (InGaAs absorptive layer)