We offer two distinct categories of devices based on mirror fabrication methodology:

Integrated mirror: An integrated mirror is monolithic, fabricated as an integral part of the overall MEMS device/actuator single-crystal silicon structure.  The mirror is later selectively metalized.  It is often 40um thick. Only smaller mirrors are integrated, usually those that have e.g. 0.8mm, 1.2mm, and 1.7mm diameter.

Bonded mirror:  A bonded mirror is fabricated separately from the MEMS device/actuator and it is a single-crystal silicon structure with excellent optical properties which can be assembled into a MEMS actuator with tip/tilt capabilities.  There are two sub-categories possible through Mirrorcle’s technology:

– Bonded mirror with no pedestal (no stand-off): The mirror is fabricated separately from the MEMS device/actuator. These mirrors are thin, have low inertia, and offer good flatness. They are bonded to the MEMS-actuator, on top of the rotating stage. Usually only smaller mirrors up to 1.2mm can be assembled this way.

– Bonded mirror with pedestal (standing off above MEMS/actuator): The mirror is fabricated separately. It is a thin plate with low inertia, but it is standing on top of a 0.3mm pedestal above the actuator. Mirror sizes of 2.0mm and larger are of this type.  This methodology allows mirrors of e.g. 6.4mm diameter which practically completely cover the underlying actuator chip.