Why use HB LED chip on silicon substrate?
Comparison on Silicon based Material and ceramic
| Silicon-based | CeramicAIN | UnitAl2O3 | |
| Cavity (μm) | Up to 300μm | N/A | N/A |
| Thickness (μm) | 500 | 380 | |
| TSV Structure | Etch | Laser Drill | Laser Drill |
| Metallization Scheme | TiW, Cu, Ni, Au | TiW, Cu, Ni, Au | TiW, Cu, Ni, Au |
| Thermal Conductivity | 140 | 170 | 20 |
| Isolation Scheme | SiO2 | Ceramic | Cermic |
| Thermal Resistance | ~4 | N/A | 10~15 |
| Cost of Material | Low | High | High |
※ Achieve Rth ~4C/W by using Silicon Substrate
Comparison of LED package materials between silicon, AlN and Ceramic substrate. Silicon has advantage over AlN or ceramic with lower cost, high thermal expansion and high thermal conductivity.
