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Sense the Future of the Light

  • About SensLite
  • Epitaxial Wafers
    • Data Center
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    • Epitaxial Wafer (Epiwafer)
      • 3’’ InP Substrate
      • Zn-diffusion completed epiwafer
      • 650nm LD epiwafer
      • 808nm Laser Epiwafer
      • 1550nm MQW Epiwafer
      • GaAs Base Epiwafer
      • InP Base epiwafer
      • Gallium Oxide (Ga2O3) Epitaxial Wafer
    • Chips and Packages
      • Silicon-Based Thermopile IR Sensor
      • 650nm Resonant cavity light emitting diode (RCLED)
      • 1310/1550nm 2.5Gbps APD-TIA TO Package
      • 1310nm 1.25/2.5Gbps DFB Laser TO Package 6.7mm FD
      • 1310nm 1.25/2.5Gbps DFB Laser TO Package 7.5mm FD
      • 1310/1550nm 2.5Gbps APD-TIA TO Package
      • 40G 1310nm PIN PD Chip
      • 40G 850nm PIN PD Chip
  • MEMS Mirrors
    • 1D Mirror
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    • 2D MEMS Laser Scanning Module
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    • MEMS Drivers
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  • LED Lighting
    • LED Materials
    • LED Chips and Package
    • Zener Diode
    • LED Driver IC
    • Package Options
      • 5.50mm ɸ 2.54 pitch
      • 5.50mm ɸ 2.84pitch
    • LED Display
      • P10 32×16
      • P12 16×16
    • LED MCPCB Seamless Module
      • 3.9mm width
      • 4.9mm Width
  • Equipments
    • PG01 Pressure Gauge
    • Wireless Otoscope
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CES 2018 Automotive Vehicle Technology DSSL by MTI

CES 2018 Automotive Vehicle Technology DSSL by MTI, #CES2018 #CES2018trend #CES2018top10 #CES2018futurelighting #CES2018laserlighting #DSSL #smartlighting #CES18LaserLighting #CES18highlight #CES2018awardwinner #MTI

https://youtu.be/czAtKNnQ4MM

https://senslite.com.tw/Home/wp-content/uploads/2018/01/20180107_CES2018_DSSL.mp4

27,334 Comments on “CES 2018 Automotive Vehicle Technology DSSL by MTI”