Features:

• Measurement for wafer thickness, TTV, bow and warp
• High Flexibility: 2”, 4”, 6” Wafer
• 12-15 load-ports for carriers
• High Throughput Rate: 1 point measurement capacity 1200 pieces/hr
• Multiple measurement method: single point, cross (9 points), asterisk (17 points)
• High Precision measurement +- 1 micron
• Wide wafer inspection range 2” and 4” (200~900um), 6” (1200~1600um)