40G  1310nm PIN PD Chip

• 40 Gb/s SONET/SDH OC-768/STM-256 short reach
• 100 Gb/s Ethernet
• 25 Gb/s 850nm applications such as Infiniband, Fibre Channel & CEI 25G/28G
• Digital applications up to 43 Gb/s baud rate
• RF photonics applications requiring low noise and high conversion gain
• Military communications

Chip configuration:

1. Both anode and cathode contacts on top surface

2. Dimension:

1200 um (width) x 400um (length) x 130 um (thickness)  Tolerance: +/-12.5um

Per channel dimension: 300 um (width) x 400 um (length)

3. Bond pad size: 80 x 90 um square